Power chips are attached to external circuits through packaging, and their performance depends on the support of the packaging. In high-power circumstances, power chips are generally packaged as power components. Chip interconnection describes the electric link on the upper surface of the chip, which is generally aluminum bonding cord in typical components. ^
Traditional power component bundle cross-section
Today, industrial silicon carbide power components still mostly use the product packaging innovation of this wire-bonded conventional silicon IGBT component. They encounter troubles such as huge high-frequency parasitical criteria, inadequate warm dissipation ability, low-temperature resistance, and insufficient insulation stamina, which limit using silicon carbide semiconductors. The display of exceptional performance. In order to solve these troubles and fully make use of the significant possible advantages of silicon carbide chips, many brand-new product packaging technologies and services for silicon carbide power modules have emerged in recent years.
Silicon carbide power module bonding method
(Figure (a) Wire bonding and (b) Cu Clip power module structure diagram (left) copper wire and (right) copper strip connection process)
Bonding materials have actually developed from gold wire bonding in 2001 to aluminum cable (tape) bonding in 2006, copper wire bonding in 2011, and Cu Clip bonding in 2016. Low-power gadgets have actually established from gold cords to copper wires, and the driving pressure is price decrease; high-power tools have actually developed from light weight aluminum wires (strips) to Cu Clips, and the driving force is to boost item efficiency. The higher the power, the greater the needs.
Cu Clip is copper strip, copper sheet. Clip Bond, or strip bonding, is a packaging procedure that uses a strong copper bridge soldered to solder to link chips and pins. Compared with typical bonding packaging approaches, Cu Clip innovation has the complying with advantages:
1. The link in between the chip and the pins is made of copper sheets, which, to a certain degree, changes the common cable bonding approach in between the chip and the pins. As a result, an unique package resistance worth, greater existing circulation, and far better thermal conductivity can be obtained.
2. The lead pin welding area does not require to be silver-plated, which can fully conserve the price of silver plating and poor silver plating.
3. The product appearance is completely consistent with regular products and is generally utilized in web servers, mobile computers, batteries/drives, graphics cards, motors, power products, and various other fields.
Cu Clip has two bonding techniques.
All copper sheet bonding technique
Both eviction pad and the Source pad are clip-based. This bonding method is extra pricey and complicated, however it can achieve much better Rdson and far better thermal impacts.
( copper strip)
Copper sheet plus cord bonding approach
The resource pad makes use of a Clip approach, and the Gate makes use of a Cable approach. This bonding method is slightly more affordable than the all-copper bonding technique, conserving wafer location (appropriate to really small entrance locations). The procedure is easier than the all-copper bonding technique and can acquire far better Rdson and far better thermal effect.
Supplier of Copper Strip
TRUNNANOÂ is a supplier of surfactant with over 12 years experience in nano-building energy conservation and nanotechnology development. It accepts payment via Credit Card, T/T, West Union and Paypal. Trunnano will ship the goods to customers overseas through FedEx, DHL, by air, or by sea. If you are finding copper glass price, please feel free to contact us and send an inquiry.
Inquiry us